Abstract
The synthetic diamond which is used for some cutting tools is known to reduce its strength after heating at an elevated temperature above 1200K. In this study, the Cu-P system alloy which has the eutectic reaction at 987K is proposed as a bonding material for sintering of diamond tools. Samples sintered at 1110K-1190K with several kinds of Cu-P system alloys were observed by a SEM and an EPMA, and investigated through a hardness test and a bending test. As the result, it was clarified that the thermal degradation of diamond can be prevented by the low temperature sintering with the Cu-P system bonding material, and the ratio of good diamond in tips increases with decrease of sintering temperature by means of applying the low melting Cu-P system alloy.
