Abstract
Electromagnetic properties of composite multilayer chip components was studied with special reference to the chemical reaction between magnetic and non-magnetic materials. It has been shown that mutual diffusion between magnetic NiCu ferrite and non-magnetic CuZn ferrite brought about the formation of high, u, NiCuZn ferrite layer, which caused the deterioration of Q-factor. Non-magnetic material of Ni-Cu-Mg-Si-O system has been newly developed for high performance composite multilayer chip components.
