Abstract
Recently, multilayer electronic ceramic devices such as chip capacitors, ceramic actuators or chip inductors have been used in electronic circuit . Mutually sandwiched layers of electronic ceramics and metallic thin film electrodes are usually sintered simultaneously. Accordingly, thermal expansion mismatch stresses occur in them owing to difference in thermal expansion between their ceramic and metal layers. These stresses may result in crack or fracture formation in their ceramic layers, decrease in their capacitances or inductances, or troubles during actuator operation.
This paper describes analytical treatment of these stresses as a function of their layer number on the basis of theoretical discussion given elsewhere for residual thermal stresses in ceramic-to-metal joints .
