Abstract
Degradation behavior of adhesion strength between Ag terminal erectrode and dielectric (BaNd2Ti4O12+Bi2O3) under heat cycle test (-40°C -+85°C) has been studied with reference to the microstructure. It is shown that the solder produces a marked stress accompanied by plastic strain on the interface between Ag terminal electrode and dielectric substrate, and this stress breaks the interface during heat cycle test. The degradation behavior was strongly affected by the properties of solder. The degradation was accelerated by using high temperature solder. It is important to control the microstructure of the interface. Addition of CuO to Ag terminal electrode was effective to suppress the degradation of adhesion strength.
