Thermal Stress Distribution of Dispersed Particle Near the Surface of Composite

Abstract

It is well known that a large thermal stress arise in a SiC whisker/Al2O3 composite. The compressive stress in the composite due to thermal expansion mismatch can introduce whisker clamping by the matrix during cooling, because the thermal expansion coefficient of the matrix is higher than that of the whisker. However, the possibility for existence of tensile stress is evaluated on the basis of a stress analysis, too. In this paper, analitical estimate of the stress was obtained by using E.Melan's theory. The caluculation has shown that a large tensile stress is generated in the surface of composite.