Abstract
Mn content dependence on the resistivity and on the reliability of NiCuZn ferrites were investigated to obtain highly reliable NiCuZn ferrites for multilayer chip components. The resistivity drastically increased by Mn addition and the obtained high resistivity was maintained even at high temperature. From the result of complex impedance analysis, it was found that the increase of resistivity might be controlled by the intra-grain resistivity. The result of high temperature life test indicated that Mn addition can be improved on the reliability of NiCuZn ferrites.
