Abstract
W-Cu system alloys are promising for thermal managing applications such as microelectronic devices because of the low thermal coefficient of W and the high thermal conductivity of Cu. These materials have been produced by conventional Cu-infiltration sintering or liquid-phase sintering. However, the infiltration sintering process has complicated and many steps, and also the constituent phases are often segregated in the form of Cu pool.
For the homogeneous constituent phases, in this study, the new concept of sintering was suggested by the application of the W-Cu composite powders to MIM process which is hoped to be an advanced powder processing technique for near net shape forming the high density, high performance, and complicated components.
Optimal thermal conductivity of the W-15mass%Cu-0.5mass%Co composite powder compact was obtained by sintering at 1673 K for 3.6 ks in H2; the relative density and the thermal conductivity were 92.5% and 151.0 W/mK, respectively.
