1999 Volume 13 Issue 4 Pages 246-251
A new method for instantaneous measurement of three thermophysical parameters of solids in si-tu is proposed. The measuring principle is based on a transient heat conduction model of a thermal probe point-contacting with a testing body. The measurement of temperature response has been made by using the probe of a sheathed K-type thermocouple in this experiment. Ratios of both thermal conductivity and thermal effusivity between the probe and the testing body are determined from curve- fitting with the theoretical response to the measured one. As a result, it is shown that the measurement is reproducible and the accuracies of measured thermophysical parameters are good enough to apply this method to many kinds of solids.