Abstract
In the present study, an integrated thin film and thin wire thermocouple was designed in order to gain an understanding of heat transfer mechanism under the baking process. The thin film thermocouple was made by depositing Cu-Ni on a base of polyimide sheet, and five hot junctions were arranged at the regular interval. Thermal electromotive force was proportional to the temperature difference between reference and hot junction. Moreover, heat transfer properties under the baking process that are equivalent to effective thermal conductivity which include latent heat transport accompanied by water vapor diffusion in addition to heat conduction are investigated using the integrated thin wire thermocouple. The effective thermal conductivity of crumb increased according to the latent heat transportation effect by water vapor diffusion, and that of crust was in agreement with the value of the effective thermal conductivity of the crust which was measured by steady state parallel plate method.
