Single crystalline silicon foils were plastically bent by laser forming method. Single crystalline silicon foils of 0.05mm thickness were used for specimen and a 50W Nd:YAG laser was employed for forming. Laser power and scanning velocity were varied under constant line energy density, and change of bending angle was investigated. Deformation behavior was also studied by using scanning electron micrograph and optical micrograph. From the experimental results, when line energy density was constant, bending angle was larger when both laser power and scanning velocity were larger. Comparing with CW mode and Q-sw pulsed mode of laser irradiation, bending angle was larger when CW mode was used. Bending angle did not depend on laser scanning direction. Line pattern in [100] direction was observed at just opposite surface of laser irradiation, although laser scanning direction was changed.