Journal of Solid Mechanics and Materials Engineering
Online ISSN : 1880-9871
ISSN-L : 1880-9871
Papers(Special Issue)
Application of L9 Orthogonal Array and Molecular Dynamics Simulation to Design of Metal Film with Strong Adhesion to Resin
Tomio IWASAKI
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2012 Volume 6 Issue 1 Pages 2-13

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Abstract
We applied Taguchi experimental design to a nano-structure multilayer film. An L9 orthogonal array and a molecular dynamics simulation were used to design a metal film made up of eight atomic layers so that the metal film was made to have strong adhesion to a resin with a polyphenyl chain (a sequential benzene-ring chain). By carrying out sensitivity analysis with the orthogonal array, among four metal-film factors (the short-side and long-side lattice mismatches with the resin Δa and Δb, surface energy G, and cohesive energy H of an atomic-layer laminated metal film), the mismatches were found to be the most dominant factors in the adhesion strength. The author also found that reducing the mismatches and increasing the surface energy and cohesive energy are effective in increasing the adhesion strength and the signal-to-noise ratio. Molecular simulations showed that a copper/ruthenium/cobalt-laminated film is an appropriate structure that has strong adhesion to the resin.
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© 2012 by The Japan Society of Mechanical Engineers
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