Abstract
A new cutting method using a pulsed magnetic field has been studied Apiece of single-crystal silicon is wound with a secondary coil, and is placed in a primary coil. When a current flows in the primary coil, the secondary coil shrinks in the radial direction. We succeeded in cutting the piece of single-crystal silicon using that stress. The smaller the electric resistance of the coil, the larger the stress. The cross-section of a silicon crystal cut by thus method has small radiant steps.
