2002 Volume 26 Issue 4 Pages 461-464
We developed a new deposition method for ultrafine particles (UFP), which is based on the vibration of particles in the electrostatic field between parallel electrodes. Fe, Ni, and Co UFP were deposited onto ZnO/glass and Cu substrates at a dc voltage of 20 kV. The film structure changed from a small-grained to a large-grained structure. Films with a large-grained structure show high reflectivity. From SEM observation of films, it was found that the main deposition process is heating and fusion of ultrafine particles by discharge in the charge exchange that occurs on collision. This deposition method can be used to prepare films with various structures, such as small-grained and large-grained structures.