Abstract
The surface smoothness, S and Ag content of electrodeposited copper were investigated to clarify the influence of chloride ions on electrorefining using hydrochloric acid and SbCl3. The surface smoothness of electrodeposited copper was improved with increasing amounts of hydrochloric acid and SbCl3 as well as lower S and Ag content. The tensile strength and elongation of the electrodeposited copper were also studied to determine if they could be used as criteria for evaluating the cathode strippability in the permanent cathode process. The tensile strength and elongation increased when the total concentration of chloride ions released from hydrochloric acid and SbCl3 was 20 mg/L. Metallographic observations indicated that lower rate of twin crystal formation resulted in higher tensile strength and elongation at approximately 20 mg/L of chloride ion concentration.
