Evaluation of Solder Composition by Surface Analysis

Abstract

Solder composition was evaluated with several methods of surface analysis. Since solder is a heterogeneous alloy, ordinary surface analysis is not adequate for accurate determination of its composition. Recently however, a method of quantification with phase analysis has been introduced in EPMA for heterogeneous systems. In this paper, we examine the validity of phase analysis for Sn-Pb eutectic solder and Sn-3.0wt%Ag-0.5wt%Cu solder, and found that phase size needs to be considered when using phase analysis.