Proposal for Improving Design Efficiency by utilizing MBD in cooperation with Tier 1 and Tier 2

- Modeling of Passive Components Compatible with VHDL-AMS and Utilization of the Model -

Abstract

In-vehicle electrical equipment is becoming smaller and more sophisticated. For the thermal design of these devices, it is important to consider not only the semiconductors, which are the main heat source, but also the passive components (resistors, capacitors, etc.) used in the peripheral circuits. In this paper, we propose a passive component model compatible with VHDL-AMS, which has been widely used for multi-domain analysis of circuits and heat. We explain the issues and the taken measures in modeling chip components, and discuss the analysis results using the model.