Papers
New oscillation polishing method with a height-adjustable retainer mechanism
Atsunobu UNE, Kenichiro YOSHITOMI, Masaaki MOCHIDA, Tatsuya SENGA, Keishin SHINJO
Author information
Keywords:
oscillation polishing,
flatness,
silicon wafer,
retainer mechanism,
pressure distribution,
cupper metal wiring,
vacuum pin chuck,
removal rate
2005 Volume 49 Issue 7 Pages 391-395
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