2009 Volume 53 Issue 10 Pages 621-626
In a cutting process for hard and brittle material, prevention of chipping and realization of a smooth cut surface would allow omission of the polishing process and markedly improve productivity. A new cut-off method, "EPD cut-off," has been developed to realize these advantages. This paper described some experimental approaches to clarify the mechanism. The results indicated that an abrasive layer underwent repeated adsorption and falling off cycles and maintained a constant thickness. The relationship between destruction conditions and the AE signal was clarified. The following mechanism was suggested, i.e., the processing unit of EPD cut-off becomes small due to cutting with many fine abrasives. Therefore, chipping was prevented and the cut surface was smooth.
