Abstract
A workpiece descent type of multi-wire saw was used for processing of silicon wafers for a solar cell panel. This slicing method used a working fluid including abrasive grains, which is called a slurry. This slurry was carried to the processing area with wire and supplied in the processing area. The processing characteristics of a multi-wire saw were influenced by both slurry behavior and supply method. In this study, the slurry behavior in slicing grooves of a rectangular workpiece was observed with a high-speed video camera. The relationships between slurry behavior in the slicing grooves and slurry supply method at the workpiece with a descent type multi-wire saw are discussed.
