Abstract
Ultrasonic machining is suitable for the high hardness and brittleness of ceramics materials, etc. However, the machining rate is slower than general cutting. To overcome this drawback, ultrasonic machining was combined with CO2 laser machining under various conditions on SiC. The changes in machining depth, machining accuracy, and tool wear were examined. The results confirmed that the best laser irradiation conditions were dependent on depth of ultrasonic machining. In conclusion, air was used as the assistance gas when the machining depth was 700μm, and the most effective conditions were laser power 150 W and scanning speed of 1000 mm/min.
