Effects of machine tool stiffness and cutting path density on infeed face grinding of silicon wafer

2^nd Report: Empirical study

Abstract

In the previous report, a new dynamic grinding model capable of incorporating the effects of cutting path density and machine tool stiffness was described. Here, the proposed model was verified in an empirical study. The results demonstrated that the dynamic grinding model can provide a better explanation of interference between the cutting edge and substrate, and the geometric profile generated in comparison to the conventional static model. Following the optimal conditions obtained through simulation by the dynamic model, an extremely flat wafer with PV less than 0.5μm has been successfully achieved in infeed grinding scheme.