Slicing characteristic of slicing processing using diamond slurry

Abstract

The multi-wire saw is used in processing to slice brittle materials with a thin wire tool and slurry. This multi-wire saw usually uses a slurry consisting of mixed processing oil and SiC grains. The slicing of sapphire ingot has attracted a great deal of attention due to the common adoption of LEDs. As sapphire is harder than silicon ingots, the multi-wire saw using SiC grain slurry cannot be used to slice the ingots. Therefore, slicing with a multi-wire saw that uses diamond grain slurry is examined. This study considered the relation between basic slicing characteristics and the characteristics of diamond slurry, such as the viscosity of the base oil, sedimentation of grains, and the shape of diamond grains. The results indicated improvements in surface properties using this multi-wire saw with diamond grains.