Abstract
Wheel scribing and breaking technology has been widely adopted for cutting of LCD glass substrates. The advantages of this technology are the lack of kerf-loss, high speed, and dry process in comparison with dicing. In addition, substrates cut by wheel scribing have no heat-affected zone, in contrast to laser cutting. Therefore, application of this method to cutting ceramic substrates is expected to reduce manufacturing costs. When alumina substrates were cut with a scribing wheel, the median crack propagation was in the thickness direction of the substrate, which also occurred in scribing glass. However, when a scribing wheel for glass was used to cut alumina substrates, the substrate could not be separated before scribing length reached 100 m because of abrasion of the scribing wheel. Therefore, we developed a new wheel for ceramic substrates, which has good abrasion resistance. The tool life of the wheel for ceramic scribing was ten times longer than that of the wheel for glass scribing.
