Abstract
This study was performed to evaluate the grinding performance from the mechanical properties of the grain layer of a superabrasive grinding wheel. The critical grain holding power was shown to change according to the kinds of filler in the grain layer of a resinoid bond diamond wheel. In addition, the amount of change in abrasive grain protrusion height in the grinding process and the characteristics of the truing were shown to change according to the kinds of filler. Moreover, the Young's modulus and the bending strength of the grain layer of a resinoid bond diamond wheel were measured by three-point bending test and the ultrasonic pulse method. The mechanical properties, such as bending strength and Young's modulus, were shown to change according to the kinds of filler. The modulus of rupture was calculated from the Young's modulus and the bending strength. The results indicated a good correlation between the modulus of rupture and the critical grain holding power. That is, the critical grain holding power of a resinoid bond diamond wheel can be evaluated from the modulus of rupture. It may be possible to predict the grinding performance from the modulus of rupture of the grain layer of a resinoid bond diamond wheel.
