Abstract
A novel poly-crystalline diamond (PCD) dicing blade was developed for SiC substrate. PCD is a type of ceramic sintered by diamond particles. The agglomerated diamond tips provide dense cutting edges at regular intervals. An ultra-thin dicing blade was manufactured with original discharging and polishing processes. Cutting evaluation was carried out under the demonstration that critical indenting depth with no cracks is 0.15μm. The results indicated that the ductile-mode dicing process could be realized with chipping-free performance. In addition, a novel discharging dressing was evaluated under ultra-pure water. Consequently, the feasibility of on-machine discharging dressing was verified by restoration of cutting edges.
