Abstract
The present study was performed to clarify the polishing properties in the case of flat and concave plates utilizing magnetic compound fluid (MCF) with the application of a magnetic field having a DC or pulse waveform. With regard to polishing of the flat plate, the effect of the distance between the polishing tool and the polished surface was investigated at each application of a steady magnetic field and a pulse magnetic field with a frequency of 0.1 Hz. With the former magnetic field, the polishing characteristics were different at every interval between the tool and the polishing surface. With the latter magnetic field, the polishing characteristics were the same over the range of δ from 0.75 to 1.75 mm for the interval between the tool and the polishing surface. Based on these results, we conducted experiments involving polishing the concave surface of a part of a spherical pit with small diameter using the tool operated parallel to the surface. The results indicated that the configuration was maintained more accurately under a pulsed magnetic field than a DC magnetic field.
