Abstract
A novel electric field activation technology was developed that improved the polishing rate of colloidal silica slurry. In general, colloidal silica slurry is used in final polishing of semiconductor substrates, such as a sapphire wafer and silicon wafer. It is a colloidal solution consisting of a stable dispersion of nanometer-size silica particles. In this study, we have developed a new nozzle that can to apply an electric field to enhance activation of colloidal silica slurry. Using this nozzle, the absolute value of the zeta potential of the silica particles became large, and the polishing rate of silicon wafer was improved by 11%.
