Abstract
A stable sapphire substrate manufacturing processing method is required because of the widespread adoption of light emitting diodes (LEDs) due to their high energy saving performance. This study was performed to develop a novel chemical mechanical polishing (CMP) method to achieve stabilization of substrate profiles in CMP processing of sapphire substrate. This paper proposes a planetary motion-assisted CMP method, in which self-revolution motion is added to substrate rotation by a planetary gear mechanism to achieve the complicated movement trajectory of the substrate. In particular, the relative friction distance of the whole surface of the substrate in the planetary motion-assisted CMP method is simulated, and a series of experiments were conducted through prototyping of dedicated equipment. In comparison to the conventional CMP method used to polish multiple substrates, the planetary motion-assisted CMP method can both decrease the total thickness variation and allow fabrication of similar profile substrates simultaneously.
