Study on fixed diamond grains on resin-coated wire and slicing characteristics

Abstract

The resin-coated wire saw is used for slicing silicon or silicon carbide wafers. In this processing method, the wire is coated with resin and a slurry in which diamond abrasive grains are suspended is used in an oscillating type multi-wire saw. In this system, when the number of embedded abrasive grains in the resin layer on the wire surface is large, the damaged layer and wafer waviness are small, and the wafer surface develops a mirror finishing surface. This study was performed to clarify the processing principle of resin-coated wire saw. The effects of machining conditions on the number of abrasive grains that bite into the resin layer on the wire were clarified using a model experimental machine. The machining efficiency and surface roughness were improved by increasing the number of abrasive grains that bite into the resin layer.