2022 Volume 66 Issue 9 Pages 524-529
Wafer actions cannot be observed in 4-way lapping because the carrier and wafer are sandwiched between the upper and lower plates. Therefore, the factors that affect the wafer actions during processing are unclear. In this study, the wafer actions were observed using an acrylic plate in place of the upper plate in a 4-way lapping machine. The results showed that the wafer rotated during lapping, but this rotation fluctuated considerably according to the position of the carrier. In addition, the lattice groove pitch of the plate or carrier material, etc., affected the wafer rotation. The effects of wafer rotation while held by the carrier on processing characteristics were then clarified experimentally.
