REDUCTION OF THERMAL STRESS I NDUCED IN CFRP BONDED STEEL PLATE BY ADDITIONALLY BONDING OF ALUMINUM ALLOY PLATES

Abstract

 In CFRP bonded steel plate, thermal stress is induced in steel plate, CFRP strips and adhesives by temperature change, due to difference in coefficients of thermal expansion between steel and CFRP. In this study, to reduce the thermal stress induced in CFRP bonded steel plate, additional bonding of aluminum alloy plates which have about twice higher coefficient of thermal expansion than that of steel plate is proposed. To verify the effectiveness of reduction of thermal stress, theoretical and numerical analyses were carried out.