Abstract
Status quo of the application of thermal analysis techniques to the appraisal and quality control of electrical and electronic materials is reviewed. Such thermal analysis techniques as TG, DTA, DSC, TMA, EGA, TSC are dealt with, whereas such electrical and electronic materials as enameled magnet wires, varnishes, epoxide resins, thermoplastic resins including cross-linked polyethylenes, thermosetting resins, mineral base transformer oils, ZnO varistor, rotating machinery insulation systems, printed circuit boards, solder glasses, photoresists, carbon fiber reinforced plastics, electronic ceramics, are investigated by use of the above-mentioned techniques. By taking advantage of these collected data, it is suggested that one can provide a data-base for electrical and electronic materials. Furthermore, it is reasonable to say that when one should develop a new material, one could adopt most suitable thermal analysis technique for its appraisal, referring to the collected data-base. The authors lay particular emphasis on applying extensively these thermal analysis techniques for developing new electronic materials.
