A Fundamental Study on the Copper Electroplating Method of Stress Analysis : Occurrence of Slip Bands in Plating Foil under Variable Stresses

Abstract

In this paper, fundamental experiments are carried out to examine the occurrence of slip bands (flecks) in a copper electroplating foil under variable stresses. The following conclusions are drawn: (1) Miner's rule holds for the occurrence of slip bands under two-level single block stressing; (2) the appearance of slip bands is dominated by the amplitude of the plating foil, cumulative fatigue damage that causes the slip initiation and the grain growth in the foil is not dominated by Miner's rule; and (4) both overstressing and under stressing reduce the heating duration for recrystallization of the copper plating foil and then promote the occurrence of slip bands.