Mechanical Problems in the Production Process of Semiconductor Devices

Abstract

Mechanical problems of semiconductor devices are reviewed. The emphasis is placed on the problems relating to deformation and strength of the device component, which are incurred in the production process. The case examples describe single crystal growth, wafer processing, wafer bonding, interconnections and packaging. Thermal stress due to different thermal expansion among the materials which constitute devices plays an important part in the deformation and strength of the devices. The object of the problems is a miniature and multi-thin-layered material system which consists of different materials. Phase transition from liquid to solid often occurs in the constituent materials during device processing. Mechanical stress is mainly induced by temperature change in the manufacturing and operating processes. Interfacial strength among bonded dissimilar materials is crucial to device reliability. In conclusion, the characteristic factors common to the mechanical problems are summarized.