JSME international journal. Ser. A, Mechanics and material engineering
Print ISSN : 1340-8046
Analysis of Bending Creep Behavior of Silicon Nitride Ceramics at Elevated Temperature
Kenji HatanakaHong Yang
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1995 Volume 38 Issue 2 Pages 194-200

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Abstract
Three-point bending creep behavior of hot-pressed silicon nitride ceramics was investigated at 1170°C. A unique creep constitutive equation consisting of linear and power law terms was proposed, and the numerical calculation programs for determining the parameters included in the constitutive equation and for describing the creep deformation behavior of silicon nitride ceramics at elevated temperatures were developed. The model for interpreting the time-dependent deflection rate and the change in curvature of the beam due to creep under three-point bend loading was also developed, which fitted well the experimental data.
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© The Japan Society of Mechanical Engineers
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