X-Ray Stress Measurement for Textured Materials

Abstract

Various stresses were applied to specimens prepared from silicon carbide and cold-rolled stainless steel, JIS type SUS 304, and the changes in peak positions of a diffraction line on a sin²ψ diagram were investigated for x-ray diffraction measurement of residual stress of textured materials. Seven peak positions of a diffraction line measured at different ψ angles for each applied stress oscillated in a sin²ψ diagram. However, the slope M and the intercept N of a straight line fitted to the seven peak positions varied linearly with the applied stress σ₀. It is confirmed analytically and experimentally that these experimental findings show that the lattice strain for a fixed ψ angle varies linearly with applied stress as is the case with isotropic materials. Therefore, the stress constant K of textured materials can be determined experimentally as the reciprocal of the slope of the straight line in the M-σ₀ diagram.