OS01W0152 Application of phase-shifting moire interferometry to thermal strain analysis of electronic package

Abstract

Thermal deformations of a newly developed electronic package, Stacked-MCP (Multi Chip Package), were measured by phase-shifting moire interferometry. This method was developed using a wedge-glass-plate as a phase shifter to obtain the displacement fields with the sensitivity of 30 nm/line. This technique also made it possible to determine the strain distributions quantitatively. Thermal loading was applied from room temperature 25℃ to two states of elevated temperatures 75℃ and 100℃, and the thermal strains were then examined. The results showed that the normal strain ε_<xx> concentrated at the ends of two silicon chips, and the transverse strain ε_<yy> enlarged between the two chips. The shear strain γ_<xy> grew at the end of the lower chip to 0.30 % from 0.17 % when the temperature increased by 25℃.