OS10W0188 Plasticity-creep separate method for viscoplastic deformation of lead-free solders

Abstract

In this paper, a viscoplastic constitutive model was proposed considering both the determination method of the material constants and the implementation method for a general purpose FEM program. The model was incorporated into FEM code "ANSYS" and its applicability to the lead-free solder alloys was verified by the simulations of the viscoplastic deformation. As a result, the proposed model was successfully incorporated into "ANSYS", and then it could accurately describe the creep and cyclic loading of three lead-free solder alloys using the material constants determined from only the pure tensile tests.