Abstract
A new technique was developed for motion compensation in thermoelastic stress measurement. Brindled pattern with different infrared emissivities was applied on the test sample for the motion analysis. Infrared images of the brindled pattern were taken under the same loading condition as the thermoelastic stress measurement. Displacements and deformations on the test sample were analyzed by the digital image correlation method based on the information of the movement of the brindled pattern. Automatic motion compensation was conducted in the subsequent thermoelastic stress measurement based on the results of displacement measurement. Another motion compensation technique without the brindled pattern was proposed, in which visible images were taken by the digital camera as well as the infrared camera. The field of view and the framing sequence of the visible and infrared camera were completely synchronized. The full field displacement measurement was conducted by the digital image correlation method using visible images, then the motion compensation of the infrared images were carried out based on this displacement data. The feasibility of the proposed motion compensation techniques was experimentally demonstrated.
