OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

Yasuhisa Fujimoto; Shuichi Arikawa; Riku Yoshida; Yohei Omoto; Satoru Yoneyama

doi:10.1299/jsmeatem.2015.14.32

The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics

Online ISSN : 2424-2837

2015.14

Session ID : OS2-13

DOI https://doi.org/10.1299/jsmeatem.2015.14.32

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OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

Yasuhisa Fujimoto, Shuichi Arikawa, Riku Yoshida, Yohei Omoto, Satoru Yoneyama

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