Abstract
It is essential to measure the residual stress of resin material to evaluate the reliability of a resin packaged electron device. The leaky surface skimming compressional wave (LSSCW) velocity is determined by the V(z) curve obtained by the acoustic microscope. The LSSCW velocity depends on the stress, therefore, it is possible to evaluate the localized residual stress using the LSSCW velocity. The purpose of this study is to establish a stress measurement method of the resin material of the electron device with an acoustic microscope for basic research. The effect of surface roughness on the LSSCW velocity is investigated using acrylic resin as the resin material. In addition, the relationship between stress and the LSSCW velocity of the resin material is examined. On the basis of these results, a stress evaluation method of resin material using the acoustic microscope is proposed.
