Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics
Online ISSN : 2433-1279
1.01.203
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Opportunities for the Application of Fracture Mechanics in Microelectronic Packaging
William T. Chen, Andy Tseng, James Hayward, Ming Li
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Pages 40-

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© 2001 The Japan Society of Mechanical Engineers
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