JSME International Journal Series B Fluids and Thermal Engineering
Online ISSN : 1347-5371
Print ISSN : 1340-8054
ISSN-L : 1340-8054
Heat Transfer
Development of Micro Channel Heat Exchanging
Koichiro KAWANOMasayuki SEKIMURAKo MINAKAMIHideo IWASAKIMasaru ISHIZUKA
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2001 Volume 44 Issue 4 Pages 592-598

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Abstract

In order to investigate the performance of the micro channel heat exchanger, three-dimensional numerical simulations and experiments on heat transfer behavior and pressure loss were carried out. So far as the heat transfer phenomena is concerned, results obtained using a silicon chip micro channel model showed a very small thermal resistance, about 0.1 (Kcm2/W). And, measured pressure loss showed good agreement with that of analytical result obtained on the basis of fully developed laminar pipe flow assumption. Furthermore, a practical setup was made with a micro channel heat exchanger to clarify the possibility of using the micro channel heat exchanger in electrical equipment. As a result, it was confirmed that the performance of the micro channel heat exchanger system is sufficient to cool a silicon chip which generates a large amount of heat, and the scale of the system is compact compared to that of the whole setup of electrical equipment.

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© 2001 by The Japan Society of Mechanical Engineers
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