Thermal Management of Electronic Components with Dielectric Liquids

Abstract

During the 1980s, direct liquid cooling emerged as one of the most promising thermal management techniques for electronic systems. Many observers believe that, later in this decade, direct liquid cooling with inert, dielectric liquids will become the method of choice for the thermal management of advanced computers. A clear understanding of the available empirical data and relevant heat transfer theories is an essential prerequisite for successful application of this technique. Following a brief survey of electronic packaging trends, attention is turned to the many options in direct liquid cooling and to the selection of coolants for electronic systems. Next, single-phase natural- and forced-convection, including impinging and streaming flow, are reviewed and the best available correlations presented. Ebullient heat transfer is discussed in depth, with a detailed exploration of boiling incipience, fully-established boiling, and critical heat flux for these highly-wetting liquids. Closing remarks focus on the prospects for the widespread implementation of direct liquid cooling in the electronic industry.