Development of Micro Ultrasonic Abrasive Machining System

(1st Report, Studies in Micro Ultrasonic Abrasive Machining)

Abstract

This paper deals with the development of a micro ultrasonic abrasive machining system. The size of every component for opto-electrical devices or micro electro-mechanical systems (MEMS) has been reduced in recent years due to progress in opto-digital communications technology. The demands for micro-sized holes, slits and 3D structures of hard brittle materials such as ceramics and glass are considerable. In this study, a micro ultrasonic abrasive machining system was developed, which has an aerostatic ultrasonic vibration spindle, 3-axis NC sliding tables, dynamometer for machining pressure control and on-machine shaping system for small-diameter tools. The tools (0.03-1.0mm in diameter) and ultra-fine SiC slurry are used in the micro ultrasonic machining, and basic characteristics in micro-hole machining of glass are investigated. As the tool diameter becomes smaller, the machining speed and tool wear become the worse. However, rotating the tool doubled the machining speed, and decreased a protrusion left in the center of the machined hole due to cavitation.