The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2000.13
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Stress-Strain Singularity of Solder Bumps
Minoru MUKAI, Hiroyuki TAKAHASHI, Takashi KAWAKAMI, Kuniaki TAKAHASHI, Kikuo KISHIMOTO
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Keywords: Solder Bump, Fatigue Life, Elastic-Creep Behavior, Stress-Strain Singularity
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Pages 645-646

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© 2000 The Japan Society of Mechanical Engineers
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