The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2001.14
Session ID : 236
Conference information
236 Monitoring of Electroplating Thickness on Silicon Wafer using Inverse Analysis
Keisuke ABE, Kenji AMAYA, Sigeru AOKI
Author information
Keywords: Finite Element Method, Thin Film, Electrical Resistance, Inverse Analysis, Electroplating
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (351K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2001 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top