The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2005.18
Session ID : 211
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211 Damage Path Simulation of Solder Joints in QFP
Minoru MUKAI, Kenji HIROHATA, Hiroyuki TAKAHASHI, Takashi KAWAKAMI, Kuniaki TAKAHASHI
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Keywords: Solder Joint, Fatigue Life, Damage Mechanics, Stress Analysis
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© 2005 The Japan Society of Mechanical Engineers
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