The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2005.18
Session ID : 205
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205 Strain Evaluation of The Micro-structures in Electronic Packages Using The Digital Image Correlation Method
Nobuyuki SHISHIDO, Toru IKEDA, Noriyuki MIYAZAKI
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Keywords: Digital image correlation method, Electronic package, Thermal deformation, Moving least square method
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© 2005 The Japan Society of Mechanical Engineers
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