Abstract
This paper describes air cooling performance for electronic circuit boards set in the thin enclosure, where cooling air flow pass is very narrowed by many mounted devices. Especially, we focused on a prediction accuracy of thermal design by using commercial CFD codes. To discuss the accuracy of thermal design using forced convection in the thin enclosure, we designed a test enclosure model which is composed of a model cardboard including 5 heat sources and a heatsink duct and inspected a temperature rise of the model board and heat sources. For the improvement of the accuracy, we compared the temperature on the board from experimental results with the board temperature from analytical results. From the result, it is found that we obtained a comparatively good agreement between the experiment and the analysis. In addition, from the temperature distribution on the board by CFD, there may be the effects of a thermal resistance distribution to the board temperature distribution.
